| 零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
|---|---|---|---|---|
Category6Cable,4Pair,F/UTP,CMP ProductDescription Category6PremiseHorizontalCable(250MHz),4Pair,23AWGSolidBareCopperConductors,F/UTP-FoilShielded,Plenum-CMP,Flamarrest®PVC-LS Jacket | BELDENBelden Inc. 百通电缆设计科技有限公司 | BELDEN | ||
ProgrammableQuadLDO GeneralDescription TheAS1352isahigh-performancequadCMOSlowdropoutvoltageregulatorinasingleQFNpackage.Theefficientsetofprogrammablepowersuppliesisoptimizedtodeliverthebestcompromisebetweenquiescentcurrentandregulatorperformanceformobilephones,PDAs,MP3pla | AMSCO austriamicrosystems AG | AMSCO | ||
ProgrammableQuadLDO | AMSCO austriamicrosystems AG | AMSCO | ||
ProgrammableQuadLDO | AMSCO austriamicrosystems AG | AMSCO | ||
ProgrammableQuadLDO | AMSCO austriamicrosystems AG | AMSCO | ||
MULTI-PAIRCOMMUNICATIONCABLE | GENERALGeneral Electric 通用电气公司美国通用电气公司 | GENERAL | ||
CC2652R7SimpleLink??Multiprotocol2.4GHzWirelessMCU | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
SimpleLinkHigh-PerformanceDual-BandWirelessMCUWithIntegratedPowerAmplifier | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2- | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3 | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU 1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3 | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager( | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TITexas Instruments 德州仪器美国德州仪器公司 | TI |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
IR |
22+ |
DIP4 |
6000 |
终端可免费供样,支持BOM配单 |
询价 | ||
IR |
23+ |
DIP4 |
8000 |
只做原装现货 |
询价 | ||
IR |
04+ |
2000 |
询价 | ||||
IOR |
DIP-4 |
256 |
询价 | ||||
IR |
0114+ |
DIP |
305 |
特价热销现货库存100%原装正品欢迎来电订购! |
询价 | ||
IR |
2020+ |
DIP-8 |
5300 |
百分百原装正品 真实公司现货库存 本公司只做原装 可 |
询价 | ||
IOR |
2339+ |
DIP8 |
5989 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
询价 | ||
IR |
23+ |
原厂原装 |
1500 |
全新原装 |
询价 | ||
IR |
2018+ |
DIP |
6528 |
承若只做进口原装正品假一赔十! |
询价 | ||
IRF |
23+ |
NA |
19960 |
只做进口原装,终端工厂免费送样 |
询价 |
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