POWERCSP中文资料amkor数据手册PDF规格书

厂商型号	POWERCSP
功能描述	PowerCSP™ is an innovative chip scale power transistor package.
文件大小	1.21918 Mbytes
页面数量	2 页
生产厂商	Amkor Technology
企业简称	amkor
中文名称	Amkor Technology官网
原厂标识
数据手册	下载地址一下载地址二到原厂下载
更新时间	2025-5-18 9:12:00
人工找货	POWERCSP价格和库存，欢迎联系客服免费人工找货

FEATURES

Low resistance/inductance packaging

Reduced form factor, Chip Scale Package (CSP)

CMOS, GaN and SiC compatible

Integrated power building block

Reduced thermal and electrical interfaces

Direct connection of the source or drain to the PCB

High percent of conductive material within the volume of the package of 30-70%

Low resistance (Rds), low inductance (Lds) and good capacitive (Ciss) performance compared to other discrete packages

Custom and standard pin layouts in a dual-sided power package

Applications

PowerCSP™ is suitable for power applications designed for low on-resistance and high-speed-switching MOSFETs such as:

Telecom/Data centers

Electric and hybrid electric vehicles

DC/DC conversion