Small Signal Transistors

Small Signal Transistors TO-92 Case (Continued)

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CENTRAL

NPN - RF Transistor Chip

Small Signal Transistor NPN - RF Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 14.5 x 14.5 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 2.4 x 2.2 MILS Emitter Bondin

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CENTRAL

Through-Hole Transistor-Small Signal (<=1A) NPN RF Oscillator

Central

Crystal Unit SMD 3.2x2.5 50.00MHz

Features: Surface Mount Hermetic Package Excellent Reliability Performance Good Frequency Perturbation and Stability over temperature Ultra Miniature Package Moisture Sensitivity Level (MSL) : Level-1 Description and Applications: Surface mount 3.2mmx2.5mm crystal unit for customer for us

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