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PMEG3050BEP-Q

5 A low VF MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. • Average forward current: IF(AV) ≤ 5 A\n• Reverse voltage: VR ≤ 30 V\n• Low forward voltage\n• High power capability due to clip-bond technology\n• Qualified according to AEC-Q101 and recommended for use in automotive applications\n• Small and flat lead SMD plastic package\n• Suitable for both refl;

Nexperia

安世

PMEG3050BEP-Q

丝印:A8;Package:CFP5;30 V, 5 A low VF Schottky barrier rectifier

1. General description Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 5 A • Reverse voltage: VR ≤ 3

文件:252.14 Kbytes 页数:12 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

PMEG3050BEP-QX

Package:SOD-128;包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 类别:分立半导体产品 二极管 - 整流器 - 单 描述:DIODE SCHOTTKY 30V 5A SOD128

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

PMEG3050EP

5 A low VF MEGA Schottky barrier rectifier

文件:157.37 Kbytes 页数:13 Pages

PHI

飞利浦

PHI

PMEG3050EP

30 V, 5 A low VF Schottky barrier rectifier

1. General description Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 5 A • Reverse voltage: VR ≤ 3

文件:1.2705 Mbytes 页数:12 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

PMEG3050EP-Q

30 V, 5 A low VF MEGA Schottky barrier rectifier

1. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward c

文件:251.66 Kbytes 页数:13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

技术参数

  • Package name:

    CFP5

  • Size (mm):

    3.8 x 2.5 x 1

  • VR [max] (V):

    30

  • IF [max] (A):

    5

  • Nr of functions:

    single

  • Configuration:

    single

  • IR [max] (µA):

    250.00002

  • Cd [max] (pF):

    800

供应商型号品牌批号封装库存备注价格
Nexperia USA Inc.
25+
SOD-128/CFP5
9350
独立分销商 公司只做原装 诚心经营 免费试样正品保证
询价
恩XP
23+
SOD-128
50000
全新原装正品现货,支持订货
询价
恩XP
23+
SOD128
89630
当天发货全新原装现货
询价
恩XP
24+
SOD128
60000
询价
恩XP
24+
SOD128
9000
只做原装,欢迎询价,量大价优
询价
Nexperia
24+
NA
3000
进口原装正品优势供应
询价
恩XP
23+
SOD128
8560
受权代理!全新原装现货特价热卖!
询价
恩XP
24+
65200
询价
NEXPERIA/安世
2447
C0603
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
Bychip/百域芯
21+
SOD-128
30000
优势供应 品质保障 可开13点发票
询价
更多PMEG3050BEP-Q供应商 更新时间2025-10-11 16:47:00