丝印：AL；Package：HUSON3；2 A low VF dual MEGA Schottky barrier rectifier

Features and benefits * Average forward current: IF(AV) ≤ 2 A * Reverse voltage: VR ≤ 20 V * Low forward voltage * Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity * Leadless small SMD plastic package with medium power capability * AEC-Q101 qualified

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2 A low VF dual MEGA Schottky barrier rectifier

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丝印：AL；Package：SOT1061；20 V, 2 A low VF dual Schottky barrier rectifier

1. General description Planar Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. 2. Features and benefits • Averag

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2 A low VF dual MEGA Schottky barrier rectifier

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丝印：CW；Package：DFN2020D-3；20 V, 2 A low VF dual MEGA Schottky barrier rectifier

文件：713.84 Kbytes 页数：15 Pages

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20 V, 2 A low VF dual MEGA Schottky barrier rectifier

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2 A low V_F dual MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. • Average forward current: IF(AV) ≤ 2 A\n• Reverse voltage: VR ≤ 20 V\n• Low forward voltage\n• Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity\n• Leadless small SMD plastic package with medium power capability\n• AEC-Q101 qualified;

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20 V, 2 A low VF dual MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application(MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3(SOT1061D) leadless small Surface-Mounted Device(SMD) plastic package with visible and solderabl • Average forward current IF(AV)≤2A\n• Reverse voltage VR≤20V\n• Low forward voltage VF≤420mV\n• Low reverse current\n• Reduced Printed-Circuit-Board(PCB) area requirements\n• Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity\n• Leadless small SMD plastic package with;

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20 V, 2 A low VF dual Schottky barrier rectifier

Nexperia

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Package：3-PowerUDFN；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：分立半导体产品 二极管 - 整流器 - 阵列 描述：DIODE ARRAY SCHOTTKY 20V 3HUSON

Nexperia USA Inc.