丝印：030V；Package：CFP15B；30 V, 3 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：261.269 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

30 V, 3 A low VF Schottky barrier rectifier

Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. • Very low forward voltage\n• High power capability due to clip-bond technology\n• Small and thin SMD plastic package\n• Qualified according to AEC-Q101 and recommended for use in automotive applications;

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安世

Package：TO-277，3-PowerDFN；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：分立半导体产品 二极管 - 整流器 - 单 描述：SCHOTTKYS IN CFP PACKAGES

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

30 V, 3 A low VF MEGA Schottky barrier rectifier

文件：703.56 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

30 V, 3 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件：261.81 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司