PACKAGED FLIP CHIP ARRAY

DESCRIPTION The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, thi

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PACKAGED FLIP CHIP ARRAY

[Protek-Devices] FEATURES ✔ CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm) ✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Pr

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PACKAGED FLIP CHIP ARRAY

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250w encapsulated flip chip tvs array

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250W ENCAPSULATED FLIP CHIP TVS ARRAY

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Packaged Flip Chip TVS Array

• IEC 61000-4-2 (ESD): Air - 15kV, Contact - 8kV\n• IEC 61000-4-4 (EFT): 40A - 5/50ns\n• Chip Scale Package 0.050” (1.270mm) x 0.030” (0.762mm)\n• ESD Protection > 25 kilovolts\n• Available in Voltages Ranging From 3.3V to 36V\n• 250 Watts Peak Pulse Power per Line (tp = 8/20µs)\n• Bidirectional Con;

Protek Devices