Intel® Advanced+ Boot Block Flash Memory (C3)

Introduction\nThis document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the following combinations:\n• 32-Mbit flash + 8-Mbit SRAM\n• 32-Mbit flash + 4-Mbit SRAM\n• 16-Mbit flash + ■ Flash Memory Plus SRAM\n   —Reduces Memory Board Space\n      Required, Simplifying PCB Design\n      Complexity\n■ SCSP Technology\n   —Smallest Memory Subsystem Footprint\n   —Area : 8 x 10 mm for 16 Mbit (0.13 µm)\n      Flash + 2 Mbit or 4 Mbit SRAM\n   —Area : 8 x 12 mm for 32 Mbit (0.13 µm)\;

Intel

英特尔

3 VOLT INTEL AdvancedBootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye

Introduction This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the following combinations: • 32-Mbit flash + 8-Mbit SRAM • 32-Mbit flash + 4-Mbit SRAM • 16-Mbit flash

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Intel

英特尔

TSOP48

微芯

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BGA

A

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BGA

NUMONXY

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