ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 页数：2 Pages

PLX

Package：144-BGA；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：集成电路（IC） 专用 描述：IC INTERFACE SPECIALIZED 144BGA

BOARDCOM

博通

ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 页数：2 Pages

PLX

BGA144

AVAGO

安华高

上传：深圳市科恒伟业电子有限公司

BGA-144

PLX

上传：深圳市恒科翔业电子有限公司