丝印：E1；Package：DFN2020D-3；30 V, 3 A NPN low VCEsat transistor

1. General description NPN low VCEsat transistor encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads. PNP complement: PBSS5330PAS 2. Features and benefits • Low col

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30 V, 3 A NPN low VCEsat transistor

NPN low VCEsat transistor encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads.\n PNP complement: PBSS5330PAS • Low collector-emitter saturation voltage VCEsat\n• High collector current capability IC and ICM\n• High collector current gain (hFE) at high IC\n• High efficiency due to less heat generation\n• High temperature applications up to 175 °C\n• Reduced Printed-Circuit Board (PCB) area requirements\n• L;

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30 V, 3 A NPN low VCEsat (BISS) transistor

DESCRIPTION NPN low VCEsat transistor in a SOT89 plastic package. FEATURES • SOT89 (SC-62) package • Low collector-emitter saturation voltage VCEsat • High collector current capability: IC and ICM • Higher efficiency leading to less heat generation • Reduced printed-circuit board requiremen

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飞利浦

Low VCEsat (BISS) transistors

文件：948.33 Kbytes 页数：12 Pages

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飞利浦

NPN low VCEsat (BISS) transistor

FEATURES •SOT89 (SC-62) package •Low collector-emitter saturation voltage VCEsat •High collector current capability: IC and ICM •Higher efficiency leading to less heat generation •Reduced printed-circuit board requirements. APPLICATIONS •Power management –DC/DC converters –Supply line s

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