Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

文件：411.98 Kbytes 页数：2 Pages

amkor

安靠科技

Innovative designs and expanding package offerings provide a platform from prototype-to-production

文件：299.57 Kbytes 页数：2 Pages

amkor

安靠科技

Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.

Features Innovative designs and expanding package offerings provide a platform from prototype-to-production. Custom ball counts up to 1521 1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm) 17 to 40 mm body sizes Thin Au wire or Cu

文件：790.66 Kbytes 页数：3 Pages

amkor

安靠科技

CHILISIN/奇力新
EIA1210

CHILISIN/奇力新

上传：深圳市创新迹电子有限公司

CHILISIN/奇力新
EIA1210

CHILISIN/奇力新

上传：深圳市创新迹电子有限公司