PBGA

Silver Wirebonding

KEYFEATURES Ag-AlloywireissofterthanCuwireresultinginlowerAl-Splashandlowerriskofbondpaddamage Ag-Alloywirehasawideprocesswindowthatimprovesmanufacturabilityfordeviceswithfragilebondpadstructures

PBGA

Innovative designs and expanding package offerings provide a platform from prototype-to-production

PBGA_V01

Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.

Features Innovativedesignsandexpandingpackageofferingsprovideaplatformfromprototype-to-production. Customballcountsupto1521 1.00,1.27&1.50mmstandardballpitchavailable(otherballpitchesavailableuponrequest,e.g.0.8mm) 17to40mmbodysizes ThinAuwireorCu