Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

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AMKOR

安靠科技

Innovative designs and expanding package offerings provide a platform from prototype-to-production

文件：299.57 Kbytes 页数：2 Pages

AMKOR

安靠科技

Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.

Features Innovative designs and expanding package offerings provide a platform from prototype-to-production. Custom ball counts up to 1521 1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm) 17 to 40 mm body sizes Thin Au wire or Cu

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AMKOR

安靠科技

SOT-89-3

NEXPERIA/安世

上传：深圳市盈慧通电子有限公司

EIA1210

CHILISIN/奇力新

上传：深圳市创新迹电子有限公司