丝印：8103610SA；Package：CFP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes 页数：18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes 页数：18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes 页数：18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes 页数：18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes 页数：18 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes 页数：18 Pages

TI

德州仪器

标准高速 PAL 电路

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Thei • Choice of Operating Speeds \n• Half-Power, A-2 Devices . . . 16 MHz Min\n• Choice of Input/Output Configuration\n• Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package\n DEVICE I INPUTS 3-STATE O OUTPUTS REGISTERED Q OUTPUTS I/O PORT S PAL16L8 1;

TI

德州仪器