丝印：81036102A；Package：LCCC；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：81036102A；Package：LCCC；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16R4AMJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16R4AMJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：8103610RA；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：8103610RA；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：8103610SA；Package：CFP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：8103610SA；Package：CFP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

20-Pin TTL Programmable Array Logic

GENERAL DESCRIPTION The PAL16R8 Family (PAL16L8, PAL16R8, PAL16R6, PAL16R4) includes the PAL16R8-5/4 Series which provides the highest speed in the 20-pin TTL PAL device family, making the series ideal for high-performance applications. The PAL16R8 Family is provided with standard 20-pin DIP and

文件：271.16 Kbytes 页数：33 Pages

AMD

超威半导体

Progammable Array Logic Series 24 (PAL Series 24)

文件：448.59 Kbytes 页数：14 Pages

NSC

国半