丝印：PAL；LOW NOISE 150mA LDO REGULATOR

FEATURES • Supply Current Typ. 50μA • Standby Mode Typ. 0.1μA • Dropout Voltage Typ. 0.25V (IOUT=150mA, VOUT=2.5V

文件：1.86134 Mbytes 页数：42 Pages

NISSHINBO

日清纺微电子

丝印：PAL16L8A-2MJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16L8A-2MJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16L8AMJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16L8AMJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16R4A-2MJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16R4A-2MJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16R4AMJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16R4AMJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：PAL16R6AMJ；Package：CDIP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器