丝印：MWJ；Package：DO-214AA；600 Watts Surface Mount Transient Voltage Suppressor

文件：630.99 Kbytes 页数：4 Pages

TSC

台湾半导体

丝印：MWJ；Package：DO-214AA；600 Watts Suface Mount Transient Voltage Suppressor

文件：133.84 Kbytes 页数：4 Pages

TSC

台湾半导体

丝印：MWJ；Package：DO-214AA；600W, 6.8V - 220V Surface Mount Transient Voltage Suppressor

文件：192.44 Kbytes 页数：6 Pages

TSC

台湾半导体

Transient Voltage Suppressors

Panjit

強茂

Package：DO-214AA，SMB；包装：卷带（TR） 类别：电路保护 TVS - 二极管 描述：TVS DIODE 85.5VWM 143.85VC SMB

Littelfuse Inc.

Transient Voltage Suppressors

FEATURES ◇ For surface mounted applications in order to optimize board space. ◇ Low profile package. ◇ Built-in strain relief. ◇ Glass passivated junction. ◇ Low inductance. ◇ Excellent clamping capability. ◇ Repetition Rate (duty cycle): 0.01. ◇ Fast response time: typically less than 1.0

文件：262.15 Kbytes 页数：4 Pages

MERITEK

Low profile package

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very

文件：615.85 Kbytes 页数：4 Pages

UMW

友台半导体

TRANSIENT VOLTAGE SUPPRESSOR 600W SURFACE MOUNT

DESCRIPTION The P6SMB i s available in SM B p a ckage MECHANICAL DATA Case: SMB Terminals: Solderable per MIL STD 750, Method 2026 Approx. Weight: 0.055g / 0.002oz FEATURES ⚫ For surface mounted applications in order to optimize board space. ⚫ Low profile package ⚫ Glass passivated

文件：409.35 Kbytes 页数：7 Pages

AITSEMI

创瑞科技

Transient Voltage Suppressors

Features 1. Halogen-free 2. Rohs compliant 3. Typical maximum temperature coefficient 4. ΔVBR = 0.1 x VBR@25°C x ΔT 5. Glass passivated Chip junction in DO-214AA package 6. 600W peak pulse capadility at 10×1000μs waveform, repetition rate(duty cycles):0.01 7. Fast response time:typically le

文件：827.5 Kbytes 页数：7 Pages

RUILON

瑞隆源

丝印：100A；Package：DO-214AA；6.8 To 600V 600W Surface Mount Transient Voltage Suppressors (TVS)

Features For surface mounted applications in order to optimize board space Low leakage Uni and Bidirectional unit Glass passivated junction Low inductance Excellent clamping capability Typical IR less than 5μA above 10V 600W Peak power capability at 10 × 1000μs waveform Repetition rate (d

文件：3.66251 Mbytes 页数：7 Pages

UNSEMI

优恩半导体