Transient Voltage Suppressor Diodes

文件：128.24 Kbytes 页数：4 Pages

DIOTEC

德欧泰克

Transient Voltage Suppressor Diodes

文件：128.24 Kbytes 页数：4 Pages

DIOTEC

德欧泰克

SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

文件：1.2741 Mbytes 页数：5 Pages

YEASHIN

亚昕科技

SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

文件：1.23226 Mbytes 页数：5 Pages

YEASHIN

亚昕科技

Transient Voltage Suppressors

Panjit

強茂

Surface mount unidirectional and bidirectional Transient Voltage Suppressor Diodes

Surface Mount unidirectional and bidirectional Transient Voltage Suppressor Diodes • Pulse power dissipation 400 W • Maximum stand-off voltage 6.5...170 V • Plastic case ~ SMA • Weight approx. 0.

文件：86.08 Kbytes 页数：2 Pages

DIOTEC

德欧泰克

Unidirectional and bidirectional Transient Voltage Suppressor diodes

P4 SMAJ 6.5...P4 SMAJ 130CA Pulse Power Dissipation: 400 W Maximum Stand-off voltage: 6,5...130 V Features • Max. solder temperature: 260°C • Plastic material has UL classification 94V-0 • For bidirectional types (suffix C or CA) electrical characteristics apply in both directions • T

文件：162.54 Kbytes 页数：3 Pages

SEMIKRON

赛米控丹佛斯

SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR VOLTAGE-5.0-170Volts?

VOLTAGE - 5.0 to 170 Volts 400Watt Peak Power Pulse FEATURES ● For surface mounted applications in order to optimize board space ● Low profile package ● Built-in strain relief ● Glass passivated junction ● Low inductance ● Excellent clamping capability ● Repetition Rate(duty cycle):0

文件：213.73 Kbytes 页数：4 Pages

SURGE

SURFACE MOUNT TRANSIENT VOLATAGE SUPPRESSOR

VOLTAGE - 5.0 to 220 Volts 400 Watt Peak Power Pulse FEATURES ● For surface mounted applications in order to optimize board space ● Low profile package ● Built-in strain relief ● Glass passivated junction ● Excellent clamping capability ● Low inductance ● Fast response time: typically less

文件：176.25 Kbytes 页数：4 Pages

FORMOSA

美丽微半导体

SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR VOLTAGE - 5.0 to 440 Volts 400 Watt Peak Power Pulse

VOLTAGE - 5.0 to 440 Volts 400 Watt Peak Power Pulse FEATURES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Excellent clamping capability • Low inductance • Fast response time: typically l

文件：102.16 Kbytes 页数：5 Pages

YEASHIN

亚昕科技