丝印：P30L50；Package：DFN5X6；30A 50V MOS Schottky Rectifier

文件：808.39 Kbytes 页数：5 Pages

PFC

节能元件

For stud devices

Features • Intended for stud mounted devices • Available in various lengths • Several devices can be mounted on a single heatsink

文件：127.44 Kbytes 页数：3 Pages

Semikron

赛米控丹佛斯

For stud devices

Features • Intended for stud mounted devices • Available in various lengths • Several devices can be mounted on a single heatsink

文件：127.44 Kbytes 页数：3 Pages

Semikron

赛米控丹佛斯

P cores and accessories

P cores and accessories

文件：88.21 Kbytes 页数：9 Pages

FERROXCUBE

P cores and accessories

P cores and accessories

文件：88.21 Kbytes 页数：9 Pages

FERROXCUBE

For stud devices

Features • Intended for stud mounted devices • Available in various lengths • Several devices can be mounted on a single heatsink

文件：127.44 Kbytes 页数：3 Pages

Semikron

赛米控丹佛斯

For stud devices

Features • Intended for stud mounted devices • Available in various lengths • Several devices can be mounted on a single heatsink

文件：127.44 Kbytes 页数：3 Pages

Semikron

赛米控丹佛斯

solid state crowbar devices

Product Description SIDACtorcomponents are solid state crowbar devices designed to protect telecom equipment during hazardous transient conditions. Capitalizing on the latest in thyristor advancements, Teccor makes SIDACtordevices with a patented ion implant technology. This technology ensures

文件：1.87705 Mbytes 页数：212 Pages

Teccor

Druckkontaktierter IGBT Press Pack IGBT

Features  Trench IGBT 3  Press Pack IGBT  Hermetically sealed housing  Double side cooled  Long term Short on Fail behavior for minimum 1 year*  High dynamic robustness  High short-circuit capability  Low VCEsat

文件：651.63 Kbytes 页数：9 Pages

Infineon

英飞凌

Druckkontaktierter IGBT Press Pack IGBT

Features  Trench IGBT 3  Press Pack IGBT  Hermetically sealed housing  Double side cooled  Long term Short on Fail behavior for minimum 1 year*  High dynamic robustness  High short-circuit capability  Low VCEsat

文件：651.63 Kbytes 页数：9 Pages

Infineon

英飞凌