Glass Passivated General Purpose Plastic Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C for D2PAK (TO-263AB package) • Solder dip 275 °C max. 10 s, per JESD 22-B106 for TO-220AC package • AEC-Q1

文件：125.92 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 10 s per JESD 22-B1

文件：143.07 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

NOVOSENSE
MSOP-10

NOVOSENSE

纳芯微电子

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Sensata
N/A

Sensata

森萨塔

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ON/安森美
SOT-563

ON/安森美

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