NCEE中文资料威世科技数据手册PDF规格书

FEATURES

• Wire bondable

• Small size: 0.020 inches square to 0.060 inches

square

• Substrate: silicon with gold backing

• Dielectric: silicon dioxide / silicon nitride

• Capacitance range: 0.5 pF to 1000 pF

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

The NC series of capacitor chips are designed for assembly

in hybrid circuits using conventional wire-bonding

techniques. They provide excellent stability and

performance, and their small size gives the hybrid designer

greater layout flexibility. They are available as MNOS or

MOS capacitors. The MOS version is to be preferred when

low dielectric absorption is required.