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MT47H64M16HR-25E AAT:H TR

包装:卷带(TR) 封装/外壳:84-TFBGA 类别:集成电路(IC) 存储器 描述:IC DRAM 1GBIT PARALLEL 84FBGA

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25AT

DDR2SDRAM

DDR2SDRAM MT47H256M4–32Megx4x8banks MT47H128M8–16Megx8x8banks MT47H64M16–8Megx16x8banks Features •VDD=1.8V±0.1V,VDDQ=1.8V±0.1V •JEDEC-standard1.8VI/O(SSTL_18-compatible) •Differentialdatastrobe(DQS,DQS#)option •4n-bitprefetcharchitecture •Dup

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25EAT

DDR2SDRAM

DDR2SDRAM MT47H256M4–32Megx4x8banks MT47H128M8–16Megx8x8banks MT47H64M16–8Megx16x8banks Features •VDD=1.8V±0.1V,VDDQ=1.8V±0.1V •JEDEC-standard1.8VI/O(SSTL_18-compatible) •Differentialdatastrobe(DQS,DQS#)option •4n-bitprefetcharchitecture •Dup

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25EIT

DDR2SDRAM

DDR2SDRAM MT47H256M4–32Megx4x8banks MT47H128M8–16Megx8x8banks MT47H64M16–8Megx16x8banks Features •VDD=1.8V±0.1V,VDDQ=1.8V±0.1V •JEDEC-standard1.8VI/O(SSTL_18-compatible) •Differentialdatastrobe(DQS,DQS#)option •4n-bitprefetcharchitecture •Dup

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25EITH

DDR2SDRAMMT47H256M4??32Megx4x8banksMT47H128M8??16Megx8x8banksMT47H64M16??8Megx16x8banks

DDR2SDRAM MT47H256M4–32Megx4x8banks MT47H128M8–16Megx8x8banks MT47H64M16–8Megx16x8banks Features •VDD=1.8V±0.1V,VDDQ=1.8V±0.1V •JEDEC-standard1.8VI/O(SSTL_18-compatible) •Differentialdatastrobe(DQS,DQS#)option •4n-bitprefetcharchitecture •Dup

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25EL

DDR2SDRAM

DDR2SDRAM MT47H256M4–32Megx4x8banks MT47H128M8–16Megx8x8banks MT47H64M16–8Megx16x8banks Features •VDD=1.8V±0.1V,VDDQ=1.8V±0.1V •JEDEC-standard1.8VI/O(SSTL_18-compatible) •Differentialdatastrobe(DQS,DQS#)option •4n-bitprefetcharchitecture •Dup

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25ELH

1Gb:x4,x8,x16DDR2SDRAM

DDR2SDRAM MT47H256M4–32Megx4x8banks MT47H128M8–16Megx8x8banks MT47H64M16–8Megx16x8banks Features •VDD=1.8V±0.1V,VDDQ=1.8V±0.1V •JEDEC-standard1.8VI/O(SSTL_18-compatible) •Differentialdatastrobe(DQS,DQS#)option •4n-bitprefetcharchitecture •Dup

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25H

DDR2SDRAMMT47H256M4??32Megx4x8banksMT47H128M8??16Megx8x8banksMT47H64M16??8Megx16x8banks

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25IT

DDR2SDRAM

DDR2SDRAM MT47H256M4–32Megx4x8banks MT47H128M8–16Megx8x8banks MT47H64M16–8Megx16x8banks Features •VDD=1.8V±0.1V,VDDQ=1.8V±0.1V •JEDEC-standard1.8VI/O(SSTL_18-compatible) •Differentialdatastrobe(DQS,DQS#)option •4n-bitprefetcharchitecture •Dup

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

MT47H64M16HR-25L

DDR2SDRAM

DDR2SDRAM MT47H256M4–32Megx4x8banks MT47H128M8–16Megx8x8banks MT47H64M16–8Megx16x8banks Features •VDD=1.8V±0.1V,VDDQ=1.8V±0.1V •JEDEC-standard1.8VI/O(SSTL_18-compatible) •Differentialdatastrobe(DQS,DQS#)option •4n-bitprefetcharchitecture •Dup

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

产品属性

  • 产品编号:

    MT47H64M16HR-25E AAT

  • 制造商:

    Micron Technology Inc.

  • 类别:

    集成电路(IC) > 存储器

  • 系列:

    Automotive, AEC-Q100

  • 包装:

    卷带(TR)

  • 存储器类型:

    易失

  • 存储器格式:

    DRAM

  • 技术:

    SDRAM - DDR2

  • 存储容量:

    1Gb(64M x 16)

  • 存储器接口:

    并联

  • 写周期时间 - 字,页:

    15ns

  • 电压 - 供电:

    1.7V ~ 1.9V

  • 工作温度:

    -40°C ~ 105°C(TC)

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    84-TFBGA

  • 供应商器件封装:

    84-FBGA(8x12.5)

  • 描述:

    IC DRAM 1GBIT PARALLEL 84FBGA

供应商型号品牌批号封装库存备注价格
MICRON
21+
BGA/TSOP
50000
特价来袭!美光一级代理入驻114电子网
询价
MICRON/美光
22+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
MICRON
2017+
BGA
54896
深圳代理原装现货进口库存(香港-日本-台湾)开17点增票
询价
MICON
2020+
BGA
742
百分百原装正品 真实公司现货库存 本公司只做原装 可
询价
MICRON
19+
BGA
256800
原厂代理渠道,每一颗芯片都可追溯原厂;
询价
MICON
23+
BGA
8560
受权代理!全新原装现货特价热卖!
询价
23+
N/A
49100
正品授权货源可靠
询价
MICRON
23+
BGA
20000
原厂原装正品现货
询价
MICRON
20+
FBGA
90000
原装正品现货/价格优势
询价
MICRON
2023+
BGA
80000
一级代理/分销渠道价格优势 十年芯程一路只做原装正品
询价
更多MT47H64M16HR-25E AAT:H TR供应商 更新时间2024-5-7 16:28:00