MSAFA1N100D中文资料美高森美数据手册PDF规格书

DESCRIPTION

The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent MOSFET die into a convenient BGA package. This device is also available as discrete individual packaged Powermite3, see Microsemi data sheet UPF1N100. This device is also available as bare die, see Microsemi data sheet MSAFA1N100D. The MM196 allows users to externally connect the MOSFETs via a motherboard or next assembly substrate into any configuration desired. Custom variations of this product incorporating other Microsemi protection die and/or passive components are available by contacting the factory.

KEY FEATURES

◾ Miniature size, Multi-Chip Module, MCM

◾ Convenient mounting, Ball Grid Array, BGA

◾ Sn63/Pb37 solder bumps (Alternate attach methods available)

◾ Maximum switch voltage 1000V

APPLICATIONS/BENEFITS

◾ Three phase switching

◾ AC-DC converters

◾ Applications utilizing multiple MOSFET die in multiple or array configurations