Rev2.1 CSM PBFREE 1333 EXT TEMP

NXP’s next-generation PowerQUICC® III integrated communications processors are designed to provide solutions for symmetrical and asymmetrical multi-core systems. Based on the scalable e500 processor and system-on-chip (SoC) platform, they deliver dual-core gigahertz plus processing performance with • Dual e500 Power Architecture cores scaling to 1.5 GHz\n• 32 KB I/D L1 cache per core\n• 64-bits (72-bits with ECC) per controller\n• Four integrated Ethernet controllers (enhanced TSEC) • 10/100/1000 support\n• Quality of service support\n• Lossless flow control\n• Single 10/100 fast Ethernet cont;

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MPC8572E PowerQUICC III Integrated Processor Hardware Specifications

文件：1.41236 Mbytes 页数：140 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications

文件：1.41236 Mbytes 页数：140 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications

文件：1.41236 Mbytes 页数：140 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体