PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

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恩XP

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

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freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MSD Pro-Billet Ready-to-Run Distributor

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MALLORY

Inline analog input terminal, version for extreme conditions, 4 inputs, 2-wire connection method

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PhoenixPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

360° NON-CONTACTING THROUGH-HOLE POSITION SENSOR

Features • Non-contacting technology: Provides long life • Output signal choices: Analog, PWM, CAN Bus • Electrical angle: The standard version is available with rotational angles in 15 degree increments, up to 360° • Connector: Flying lead terminated w/6 pin AMP connector P/N 776434-1, cont

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Sensata

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