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MPC8260A

PowerQUICC??II Integrated Communications Processor Hardware Specifications

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPC8260ACVVMIBB

PQ II HIP4 NO-PB REV B; System core microprocessor supporting frequencies of 133-300 MHz\n• 190 MIPS at 100 MHz (Dhrystone 2.1)\n• 505 MIPS at 266 MHz (Dhrystone 2.1)\n• 570 MIPS at 300 MHz (Dhrystone 2.1)\n• High-performance, superscalar microprocessor\n• Disable CPU mode\n• Supports the NXP® external L2 cache chip (MPC2605)\n• Improved low-power core\n• 16 Kbyte data and 16 Kbyte instruction cache, four-way set associative\n• Memory Management Unit\n• Floating point unit enabled\n• Common on-chip processor (COP)\n• System Integration Unit (SIU)• Memory Controller, including two dedicated SDRAM machines\n• PCI up to 66 MHz (available in subsequent versions)\n• Hardware bus monitor and software watchdog timer\n• IEEE 1149.1 JTAG test access port\n• High-Performance Communications Processor Module (CPM) with operating frequencyup to 133, 166, or 200 MHz• G2 core and CPM may run at different frequencies\n• Parallel I/0 Registers\n• On-board 32 KBytes of dual-port RAM\n• Two multi-channel controllers (MCCs) each supporting 128 full-duplex,64 Kbps, HDLC lines\n• Virtual DMA Functionality\n• Three FCCs supporting:• Up to 155 Mbps ATM SAR (maximum of two) (AAL0, AAL1, AAL2, AAL5)\n• 10/100 Mbps Ethernet (up to three) (IEEE 802.3X with Flow Control)\n• 45 Mbps HDLC/Transparent (up to three)\n• Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus\n• Two UTOPIA level-2 master/slave ports, both with multi-PHY support.\n• Three MII Interfaces\n• Eight TDM interfaces (T1/E1), two TDM ports can be glueless to T3/E3\n• 1.8V or 2.0V internal and 3.3V I/O\n• 300 MHz power consumption: 2.5 W\n• 480 TBGA package (37.5 mm x 37.5 mm)\n;

The MPC8260 PowerQUICC® II™ is an advanced integrated communications processor designed for the telecommunications and networking markets.\nThe MPC8260 now offers floating point support.\nThe MPC8260 PowerQUICC II can best be described as the next generation MPC860 PowerQUICC®, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.\nLike the MPC860, the MPC8260 integrates two main components, the embedded G2 core and the Communications Processor Module (CPM). This dual-processor architecture consumes less power than traditional architectures because the CPM offloads peripheral tasks from the embedded G2 core. The CPM simultaneously supports three fast serial communications controllers (FCCs), two multichannel controllers (MCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the MPC8260, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.\n

NXPNXP Semiconductors

恩智浦恩智浦半导体公司

MPC8260ACZUMHBB

POWERQUICC II HIP4 REV B; System core microprocessor supporting frequencies of 133-300 MHz\n• 190 MIPS at 100 MHz (Dhrystone 2.1)\n• 505 MIPS at 266 MHz (Dhrystone 2.1)\n• 570 MIPS at 300 MHz (Dhrystone 2.1)\n• High-performance, superscalar microprocessor\n• Disable CPU mode\n• Supports the NXP® external L2 cache chip (MPC2605)\n• Improved low-power core\n• 16 Kbyte data and 16 Kbyte instruction cache, four-way set associative\n• Memory Management Unit\n• Floating point unit enabled\n• Common on-chip processor (COP)\n• System Integration Unit (SIU)• Memory Controller, including two dedicated SDRAM machines\n• PCI up to 66 MHz (available in subsequent versions)\n• Hardware bus monitor and software watchdog timer\n• IEEE 1149.1 JTAG test access port\n• High-Performance Communications Processor Module (CPM) with operating frequencyup to 133, 166, or 200 MHz• G2 core and CPM may run at different frequencies\n• Parallel I/0 Registers\n• On-board 32 KBytes of dual-port RAM\n• Two multi-channel controllers (MCCs) each supporting 128 full-duplex,64 Kbps, HDLC lines\n• Virtual DMA Functionality\n• Three FCCs supporting:• Up to 155 Mbps ATM SAR (maximum of two) (AAL0, AAL1, AAL2, AAL5)\n• 10/100 Mbps Ethernet (up to three) (IEEE 802.3X with Flow Control)\n• 45 Mbps HDLC/Transparent (up to three)\n• Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus\n• Two UTOPIA level-2 master/slave ports, both with multi-PHY support.\n• Three MII Interfaces\n• Eight TDM interfaces (T1/E1), two TDM ports can be glueless to T3/E3\n• 1.8V or 2.0V internal and 3.3V I/O\n• 300 MHz power consumption: 2.5 W\n• 480 TBGA package (37.5 mm x 37.5 mm)\n;

The MPC8260 PowerQUICC® II™ is an advanced integrated communications processor designed for the telecommunications and networking markets.\nThe MPC8260 now offers floating point support.\nThe MPC8260 PowerQUICC II can best be described as the next generation MPC860 PowerQUICC®, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.\nLike the MPC860, the MPC8260 integrates two main components, the embedded G2 core and the Communications Processor Module (CPM). This dual-processor architecture consumes less power than traditional architectures because the CPM offloads peripheral tasks from the embedded G2 core. The CPM simultaneously supports three fast serial communications controllers (FCCs), two multichannel controllers (MCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the MPC8260, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.\n

NXPNXP Semiconductors

恩智浦恩智浦半导体公司

MPC8260ACZUMIBB

POWERQUICC II HIP4 REV B; System core microprocessor supporting frequencies of 133-300 MHz\n• 190 MIPS at 100 MHz (Dhrystone 2.1)\n• 505 MIPS at 266 MHz (Dhrystone 2.1)\n• 570 MIPS at 300 MHz (Dhrystone 2.1)\n• High-performance, superscalar microprocessor\n• Disable CPU mode\n• Supports the NXP® external L2 cache chip (MPC2605)\n• Improved low-power core\n• 16 Kbyte data and 16 Kbyte instruction cache, four-way set associative\n• Memory Management Unit\n• Floating point unit enabled\n• Common on-chip processor (COP)\n• System Integration Unit (SIU)• Memory Controller, including two dedicated SDRAM machines\n• PCI up to 66 MHz (available in subsequent versions)\n• Hardware bus monitor and software watchdog timer\n• IEEE 1149.1 JTAG test access port\n• High-Performance Communications Processor Module (CPM) with operating frequencyup to 133, 166, or 200 MHz• G2 core and CPM may run at different frequencies\n• Parallel I/0 Registers\n• On-board 32 KBytes of dual-port RAM\n• Two multi-channel controllers (MCCs) each supporting 128 full-duplex,64 Kbps, HDLC lines\n• Virtual DMA Functionality\n• Three FCCs supporting:• Up to 155 Mbps ATM SAR (maximum of two) (AAL0, AAL1, AAL2, AAL5)\n• 10/100 Mbps Ethernet (up to three) (IEEE 802.3X with Flow Control)\n• 45 Mbps HDLC/Transparent (up to three)\n• Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus\n• Two UTOPIA level-2 master/slave ports, both with multi-PHY support.\n• Three MII Interfaces\n• Eight TDM interfaces (T1/E1), two TDM ports can be glueless to T3/E3\n• 1.8V or 2.0V internal and 3.3V I/O\n• 300 MHz power consumption: 2.5 W\n• 480 TBGA package (37.5 mm x 37.5 mm)\n;

The MPC8260 PowerQUICC® II™ is an advanced integrated communications processor designed for the telecommunications and networking markets.\nThe MPC8260 now offers floating point support.\nThe MPC8260 PowerQUICC II can best be described as the next generation MPC860 PowerQUICC®, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.\nLike the MPC860, the MPC8260 integrates two main components, the embedded G2 core and the Communications Processor Module (CPM). This dual-processor architecture consumes less power than traditional architectures because the CPM offloads peripheral tasks from the embedded G2 core. The CPM simultaneously supports three fast serial communications controllers (FCCs), two multichannel controllers (MCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the MPC8260, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.\n

NXPNXP Semiconductors

恩智浦恩智浦半导体公司

MPC8260ACVR

MPC826xA (HiP4) Family Hardware Specifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260ACZU

MPC826xA (HiP4) Family Hardware Specifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260AEC

MPC826xA (HiP4) Family Hardware Specifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260AVR

MPC826xA (HiP4) Family Hardware Specifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260AZU

MPC826xA (HiP4) Family Hardware Specifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

详细参数

  • 型号:

    MPC8260A

  • 制造商:

    FREESCALE

  • 制造商全称:

    Freescale Semiconductor, Inc

  • 功能描述:

    PowerQUICC⑩ II Integrated Communications Processor Hardware Specifications

供应商型号品牌批号封装库存备注价格
FREESCALE
23+
NA
19960
只做进口原装,终端工厂免费送样
询价
MOROTOLA
23+
BGA
2500
绝对全新原装!现货!特价!请放心订购!
询价
FREESCALE
17+
480TBGA
6200
100%原装正品现货
询价
MOT
25+
BGA
3000
强调现货,随时查询!
询价
原厂
23+
BGA
5000
原装正品,假一罚十
询价
FRS
24+
2
询价
MOT
24+
BGA
6980
原装现货,可开13%税票
询价
MOTOROLA
24+
BGA
5632
公司原厂原装现货假一罚十!特价出售!强势库存!
询价
Freesca
2020+
BGA
39
百分百原装正品 真实公司现货库存 本公司只做原装 可
询价
FREESCAL
23+
BGA
19726
询价
更多MPC8260A供应商 更新时间2025-7-28 13:45:00