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MPC8260ACVVMIBB

PQ II HIP4 NO-PB REV B; System core microprocessor supporting frequencies of 133-300 MHz\n• 190 MIPS at 100 MHz (Dhrystone 2.1)\n• 505 MIPS at 266 MHz (Dhrystone 2.1)\n• 570 MIPS at 300 MHz (Dhrystone 2.1)\n• High-performance, superscalar microprocessor\n• Disable CPU mode\n• Supports the NXP® external L2 cache chip (MPC2605)\n• Improved low-power core\n• 16 Kbyte data and 16 Kbyte instruction cache, four-way set associative\n• Memory Management Unit\n• Floating point unit enabled\n• Common on-chip processor (COP)\n• System Integration Unit (SIU)• Memory Controller, including two dedicated SDRAM machines\n• PCI up to 66 MHz (available in subsequent versions)\n• Hardware bus monitor and software watchdog timer\n• IEEE 1149.1 JTAG test access port\n• High-Performance Communications Processor Module (CPM) with operating frequencyup to 133, 166, or 200 MHz• G2 core and CPM may run at different frequencies\n• Parallel I/0 Registers\n• On-board 32 KBytes of dual-port RAM\n• Two multi-channel controllers (MCCs) each supporting 128 full-duplex,64 Kbps, HDLC lines\n• Virtual DMA Functionality\n• Three FCCs supporting:• Up to 155 Mbps ATM SAR (maximum of two) (AAL0, AAL1, AAL2, AAL5)\n• 10/100 Mbps Ethernet (up to three) (IEEE 802.3X with Flow Control)\n• 45 Mbps HDLC/Transparent (up to three)\n• Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus\n• Two UTOPIA level-2 master/slave ports, both with multi-PHY support.\n• Three MII Interfaces\n• Eight TDM interfaces (T1/E1), two TDM ports can be glueless to T3/E3\n• 1.8V or 2.0V internal and 3.3V I/O\n• 300 MHz power consumption: 2.5 W\n• 480 TBGA package (37.5 mm x 37.5 mm)\n;

The MPC8260 PowerQUICC® II™ is an advanced integrated communications processor designed for the telecommunications and networking markets.\nThe MPC8260 now offers floating point support.\nThe MPC8260 PowerQUICC II can best be described as the next generation MPC860 PowerQUICC®, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.\nLike the MPC860, the MPC8260 integrates two main components, the embedded G2 core and the Communications Processor Module (CPM). This dual-processor architecture consumes less power than traditional architectures because the CPM offloads peripheral tasks from the embedded G2 core. The CPM simultaneously supports three fast serial communications controllers (FCCs), two multichannel controllers (MCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the MPC8260, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.\n

NXPNXP Semiconductors

恩智浦恩智浦半导体公司

MPC8260ACZU

MPC826xA(HiP4)FamilyHardwareSpecifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260AEC

MPC826xA(HiP4)FamilyHardwareSpecifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260AVR

MPC826xA(HiP4)FamilyHardwareSpecifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260AZU

MPC826xA(HiP4)FamilyHardwareSpecifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260CVR

MPC826xA(HiP4)FamilyHardwareSpecifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260CZU

MPC826xA(HiP4)FamilyHardwareSpecifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260EC

PowerQUICCIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

MPC8260VR

MPC826xA(HiP4)FamilyHardwareSpecifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

MPC8260ZU

MPC826xA(HiP4)FamilyHardwareSpecifications

MotorolaMotorola, Inc

摩托罗拉加尔文制造公司

详细参数

  • 型号:

    MPC8260ACVVMIBB

  • 功能描述:

    微处理器 - MPU PQ II HIP4 REV B

  • RoHS:

  • 制造商:

    Atmel

  • 处理器系列:

    SAMA5D31

  • 核心:

    ARM Cortex A5

  • 数据总线宽度:

    32 bit

  • 最大时钟频率:

    536 MHz

  • 程序存储器大小:

    32 KB 数据 RAM

  • 大小:

    128 KB

  • 接口类型:

    CAN, Ethernet, LIN, SPI,TWI, UART, USB

  • 工作电源电压:

    1.8 V to 3.3 V

  • 最大工作温度:

    + 85 C

  • 安装风格:

    SMD/SMT

  • 封装/箱体:

    FBGA-324

供应商型号品牌批号封装库存备注价格
FSL
23+
原厂原封装
504
正迈科技☑原装☑进口☑诚信大量原装
询价
FREESCAL
BGA
3200
绝对原装正品!量大可订!价格优势!
询价
FREESCAL
2015+
BGA
5700
进口原装正品 能17%开增值发票
询价
FREESCALE
24+
BGA48
23000
免费送样原盒原包现货一手渠道联系
询价
FREESCALE
24+
BGA
48650
诚信经营原装现货
询价
Freescale
25+
BGA
1200
保证有货!质优价美!欢迎查询!!
询价
FREESCAL
23+
BGA
19726
询价
FREESCALE
23+
原厂原包封装
8000
全新原装假一赔十
询价
FREESCALE
22+
TBGA48037.5S
2000
原装现货库存.价格优势
询价
FREESCALE
18+
BGA
37198
全新原装现货,可出样品,可开增值税发票
询价
更多MPC8260ACVVMIBB供应商 更新时间2025-7-28 13:22:00