MO-192

The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Packageheightdownto0.6mm Design,assemblyandtestcapabilitiesthatenablestackingcombinationsofmemory,logicandmixedsignaltypedevices EstablishedpackageinfrastructurewithstandardCABGAandfcCSPfootprints Consistentproductperformancewithhighyieldsandrel

NB-PTCO-192

PlatinumThinFilm(PTF)TemperatureElements

NTE192

SiliconComplementaryTransistorsAudioPowerOutput

Description: NTE192(NPN)/NTE193(PNP)andNTE192A(NPN)/NTE193A(PNP)aresiliconcomplementarytransistorsinaTO92HStypepackagedesignedforuseingeneralpurposeindustrialcircuits.Thesedevicesareespeciallysuitedforhighlevellinearamplifiersormediumspeedswitchingcircuits

NTE192A

SiliconComplementaryTransistorsAudioPowerOutput

Description: NTE192(NPN)/NTE193(PNP)andNTE192A(NPN)/NTE193A(PNP)aresiliconcomplementarytransistorsinaTO92HStypepackagedesignedforuseingeneralpurposeindustrialcircuits.Thesedevicesareespeciallysuitedforhighlevellinearamplifiersormediumspeedswitchingcircuits

OC-192

ReturntoZero(RZ)andDuo-BinaryExtendedReach

OEN192

TMIEDELAYRELAY

OPA192

HighVoltage,Rail-to-RailInput/Output,PrecisionOperationalAmplifiers,e-trimSeries

OPA192

36-V,Precision,Rail-to-RailInput/Output,Low-OffsetVoltage,Low-InputBiasCurrentOpAmpWithe-trim

OPA192

OPAx189Precision,Lowest-Noise,36-V,Zero-Drift,14-MHz,MUX-Friendly,Rail-to-RailOutputOperationalAmplifiers

OPA192ID

HighVoltage,Rail-to-RailInput/Output,PrecisionOperationalAmplifiers,e-trimSeries