The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Package height down to 0.6 mm Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices Established package infrastructure with standard CABGA and fcCSP footprints Consistent product performance with high yields and rel

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AMKOR

安靠科技

Platinum Thin Film (PTF) Temperature Elements

文件：350.32 Kbytes 页数：8 Pages

TEC

泰科电子

Silicon Complementary Transistors Audio Power Output

Description: NTE192 (NPN)/NTE193 (PNP) and NTE192A (NPN)/NTE193A (PNP) are silicon complementary transistors in a TO92HS type package designed for use in general purpose industrial circuits. These devices are especially suited for high level linear amplifiers or medium speed switching circuits

文件：22.27 Kbytes 页数：2 Pages

NTE

Silicon Complementary Transistors Audio Power Output

Description: NTE192 (NPN)/NTE193 (PNP) and NTE192A (NPN)/NTE193A (PNP) are silicon complementary transistors in a TO92HS type package designed for use in general purpose industrial circuits. These devices are especially suited for high level linear amplifiers or medium speed switching circuits

文件：22.27 Kbytes 页数：2 Pages

NTE