丝印：MMX；Package：SOT363；DUAL N-CHANNEL ENHANCEMENT MODE MOSFET

Features  Dual N-Channel MOSFET  Low On-Resistance  Low Gate Threshold Voltage  Low Input Capacitance  Fast Switching Speed  Small Surface Mount Package  ESD Protected up to 2kV  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (No

文件：380.92 Kbytes 页数：5 Pages

DIODES

美台半导体

丝印：MMX；Package：SOT363；DUAL N-CHANNEL ENHANCEMENT MODE MOSFET

Features  Dual N-Channel MOSFET  Low On-Resistance  Low Gate Threshold Voltage  Low Input Capacitance  Fast Switching Speed  Small Surface Mount Package  ESD Protected up to 2kV  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (No

文件：380.92 Kbytes 页数：5 Pages

DIODES

美台半导体

200 mW Zener Diodes 2.4 to 39 Volts

Features ● Planar Die construction ● 200mW Power Dissipation ● Zener Voltages from 2.4V - 39V ● Ideally Suited for Automated Assembly Processes Mechanical Data ● Case: SOD-323 Molded Plastic ● Terminals: Solderable per MIL-STD-202, Method 208 ● Approx. Weight: 0.008 gram ● Mounting Positi

文件：410.67 Kbytes 页数：4 Pages

MCC

200 mW Zener Diodes 2.4 to 39 Volts

Features ● Planar Die construction ● 200mW Power Dissipation ● Zener Voltages from 2.4V - 39V ● Ideally Suited for Automated Assembly Processes Mechanical Data ● Case: SOD-323 Molded Plastic ● Terminals: Solderable per MIL-STD-202, Method 208 ● Approx. Weight: 0.008 gram ● Mounting Positi

文件：410.67 Kbytes 页数：4 Pages

MCC

200 mW Zener Diodes 2.4 to 39 Volts

Features ● Planar Die construction ● 200mW Power Dissipation ● Zener Voltages from 2.4V - 39V ● Ideally Suited for Automated Assembly Processes Mechanical Data ● Case: SOD-323 Molded Plastic ● Terminals: Solderable per MIL-STD-202, Method 208 ● Approx. Weight: 0.008 gram ● Mounting Positi

文件：410.67 Kbytes 页数：4 Pages

MCC

200 mW Zener Diodes 2.4 to 39 Volts

Features ● Planar Die construction ● 200mW Power Dissipation ● Zener Voltages from 2.4V - 39V ● Ideally Suited for Automated Assembly Processes Mechanical Data ● Case: SOD-323 Molded Plastic ● Terminals: Solderable per MIL-STD-202, Method 208 ● Approx. Weight: 0.008 gram ● Mounting Positi

文件：410.67 Kbytes 页数：4 Pages

MCC

200 mW Zener Diodes 2.4 to 39 Volts

Features ● Planar Die construction ● 200mW Power Dissipation ● Zener Voltages from 2.4V - 39V ● Ideally Suited for Automated Assembly Processes Mechanical Data ● Case: SOD-323 Molded Plastic ● Terminals: Solderable per MIL-STD-202, Method 208 ● Approx. Weight: 0.008 gram ● Mounting Positi

文件：410.67 Kbytes 页数：4 Pages

MCC

200 mW Zener Diodes 2.4 to 39 Volts

Features ● Planar Die construction ● 200mW Power Dissipation ● Zener Voltages from 2.4V - 39V ● Ideally Suited for Automated Assembly Processes Mechanical Data ● Case: SOD-323 Molded Plastic ● Terminals: Solderable per MIL-STD-202, Method 208 ● Approx. Weight: 0.008 gram ● Mounting Positi

文件：410.67 Kbytes 页数：4 Pages

MCC

200 mW Zener Diodes 2.4 to 39 Volts

Features ● Planar Die construction ● 200mW Power Dissipation ● Zener Voltages from 2.4V - 39V ● Ideally Suited for Automated Assembly Processes Mechanical Data ● Case: SOD-323 Molded Plastic ● Terminals: Solderable per MIL-STD-202, Method 208 ● Approx. Weight: 0.008 gram ● Mounting Positi

文件：410.67 Kbytes 页数：4 Pages

MCC

200 mW Zener Diodes 2.4 to 39 Volts

Features ● Planar Die construction ● 200mW Power Dissipation ● Zener Voltages from 2.4V - 39V ● Ideally Suited for Automated Assembly Processes Mechanical Data ● Case: SOD-323 Molded Plastic ● Terminals: Solderable per MIL-STD-202, Method 208 ● Approx. Weight: 0.008 gram ● Mounting Positi

文件：410.67 Kbytes 页数：4 Pages

MCC