Package SSOP44

文件：84.5 Kbytes 页数：1 Pages

ZMD

Package SSOP44

Renesas

瑞萨

3 WATT GLASS ZENER DIODES

FEATURES ● Microminiature package. ● Voidless hermetically sealed glass package. ● Triple layer passivation. ● Metallurgically bonded. ● High performance characteristics. ● Stable operation at temperature to 200°C ● Very low thermal impedance.

文件：71.18 Kbytes 页数：2 Pages

MICROSEMI

美高森美

QUAD SMART POWER SOLID STATE RELAY FOR COMPLETE H-BRIDGE CONFIGURATIONS

DESCRIPTION The VN771 is a device formed by three monolithic chips housed in a standard SO-28 package: a double high side and two Power MOSFETs. The double high side are made using STMicroelectronics VIPower technology; Power MOSFETs are made by using the new advanced strip lay-out technology Thi

文件：87.03 Kbytes 页数：10 Pages

STMICROELECTRONICS

意法半导体

QUAD SMART POWER SOLID STATE RELAY FOR COMPLETE H BRIDGE CONFIGURATIONS

DESCRIPTION The VN771P is a device formed by three monolithic chips housed in a standard SO28 package: a double high side and two low side switches. Both the double high side and low side switches are made using STMicroelectronics VIPower technology. This device is suitable to drive a DC motor in

文件：95.82 Kbytes 页数：11 Pages

STMICROELECTRONICS

意法半导体