首页 >MAX209EEAG>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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SiliconEpicapDiodes SiliconEpicapDiodes Designedforgeneralfrequencycontrolandtuningapplications;providingsolid−statereliabilityinreplacementofmechanicaltuningmethods. Features •HighQwithGuaranteedMinimumValuesatVHFFrequencies •ControlledandUniformTuningRatio •Availablei | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
HARDWAREACCESSORIES | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
LaserDiode | NICHIANichia Corporation&Subsidiaries 日亚化学工业株式会社 | NICHIA | ||
MINIATUREHIGHPERFORMANCELOWCOSTSTZRELAY MainFeatures: 1.Highperformancelowcost2transfer(DPDT)P.C.Board UseRelay 2.Smallestsize(20.7mmx16.1mmx14.3mm)andlight weight(8.5grams) 3.Switchingoperationcoveringloadcurrentby3Awithcon- tactelementsystemofAgCd0 4.Highdielectricstrengthcoveringmoreth | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
MINIATUREHIGHPERFORMANCELOWCOSTSTZRELAY MainFeatures: 1.Highperformancelowcost2transfer(DPDT)P.C.Board UseRelay 2.Smallestsize(20.7mmx16.1mmx14.3mm)andlight weight(8.5grams) 3.Switchingoperationcoveringloadcurrentby3Awithcon- tactelementsystemofAgCd0 4.Highdielectricstrengthcoveringmoreth | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
MINIATUREHIGHPERFORMANCELOWCOSTSTZRELAY MainFeatures: 1.Highperformancelowcost2transfer(DPDT)P.C.Board UseRelay 2.Smallestsize(20.7mmx16.1mmx14.3mm)andlight weight(8.5grams) 3.Switchingoperationcoveringloadcurrentby3Awithcon- tactelementsystemofAgCd0 4.Highdielectricstrengthcoveringmoreth | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
MINIATUREHIGHPERFORMANCELOWCOSTSTZRELAY MainFeatures: 1.Highperformancelowcost2transfer(DPDT)P.C.Board UseRelay 2.Smallestsize(20.7mmx16.1mmx14.3mm)andlight weight(8.5grams) 3.Switchingoperationcoveringloadcurrentby3Awithcon- tactelementsystemofAgCd0 4.Highdielectricstrengthcoveringmoreth | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
MINIATUREHIGHPERFORMANCELOWCOSTSTZRELAY MainFeatures: 1.Highperformancelowcost2transfer(DPDT)P.C.Board UseRelay 2.Smallestsize(20.7mmx16.1mmx14.3mm)andlight weight(8.5grams) 3.Switchingoperationcoveringloadcurrentby3Awithcon- tactelementsystemofAgCd0 4.Highdielectricstrengthcoveringmoreth | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
MINIATUREHIGHPERFORMANCELOWCOSTSTZRELAY MainFeatures: 1.Highperformancelowcost2transfer(DPDT)P.C.Board UseRelay 2.Smallestsize(20.7mmx16.1mmx14.3mm)andlight weight(8.5grams) 3.Switchingoperationcoveringloadcurrentby3Awithcon- tactelementsystemofAgCd0 4.Highdielectricstrengthcoveringmoreth | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
MINIATUREHIGHPERFORMANCELOWCOSTSTZRELAY MainFeatures: 1.Highperformancelowcost2transfer(DPDT)P.C.Board UseRelay 2.Smallestsize(20.7mmx16.1mmx14.3mm)andlight weight(8.5grams) 3.Switchingoperationcoveringloadcurrentby3Awithcon- tactelementsystemofAgCd0 4.Highdielectricstrengthcoveringmoreth | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC |
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