Stacked Chip 8M Flash and 1M SRAM

Description The LRS1302 is a combination memory organized as 1,048,576 X 8 bit flash memory and 131,072 X 8 bit static RAM in package. It is fabricated using silicon-gate CMOS process technology.

文件：3.40731 Mbytes 页数：61 Pages

SHARPSharp Corporation

夏普

Stacked Chip 16M Flash and 2M SRAM

Description The LRS1329 is a combination memory organized as 1M x16/2M x8 bit flash memory and 256K x8 bit static in one package.

文件：1.31605 Mbytes 页数：27 Pages

SHARPSharp Corporation

夏普

Stacked Chip 16M Flash Memory and 4M SRAM

DESCRIPTION The LRS1331 is a combination memory organized as 1,048,576 × 16-bit flash memory and 262,144 × 16-bit static RAM in one package. FEATURES • Flash Memory and SRAM • Stacked Die Chip Scale Package • 72-ball 8 mm × 11 mm CSP plastic package • Power supply: 2.7 V to 3.6 V • Operatin

文件：216.7 Kbytes 页数：26 Pages

SHARPSharp Corporation

夏普

Stacked Chip 32M Flash Memory and 4M SRAM

Description The LRS1337 is a combination memory organized as 3,097,152 X 16 bit flash memory and 262,144 X 16 bit static RAM in one package. Features

文件：967.55 Kbytes 页数：30 Pages

SHARPSharp Corporation

夏普

Stacked Chip 8M Flash Memory and 2M SRAM

DESCRIPTION The LRS1338A is a combination memory organized as 524,288 × 16-bit flash memory and 262,144 × 8-bit static RAM in one package. It is fabricated using silicon gate CMOS process technology. FEATURES • Flash memory and SRAM • Stacked die chip scale package • 48-pin TSOP (TSOP48-P-101

文件：218.03 Kbytes 页数：36 Pages

SHARPSharp Corporation

夏普

Stacked Chip 16M Flash Memory and 2M SRAM

DESCRIPTION The LRS1341/LRS1342 is a combination memory organized as 1,048,576 × 16-bit flash memory and 131,072 × 16-bit static RAM in one package. FEATURES • Flash Memory and SRAM • Stacked Die Chip Scale Package • 72-ball CSP (FBGA072-P-0811) plastic package • Power supply: 2.7 V to 3.6 V

文件：197.67 Kbytes 页数：24 Pages

SHARPSharp Corporation

夏普

Stacked Chip 16M Flash Memory and 2M SRAM

DESCRIPTION The LRS1341/LRS1342 is a combination memory organized as 1,048,576 × 16-bit flash memory and 131,072 × 16-bit static RAM in one package. FEATURES • Flash Memory and SRAM • Stacked Die Chip Scale Package • 72-ball CSP (FBGA072-P-0811) plastic package • Power supply: 2.7 V to 3.6 V

文件：197.67 Kbytes 页数：24 Pages

SHARPSharp Corporation

夏普

STACKED CHIP 32M FLASH AND 4M SRAM

Description The LRS1381 is a combination memory organized as 2,097,152 x16 bit flash memory and 262,144 x16 bit static RAM in one package. Features - Power supply • • • • 2.7V to 3.3V - Operating temperature • • • • -25°C to +85°C - Not designed or rated as radiation hardened - 72pin CSP (LC

文件：4.150689 Mbytes 页数：114 Pages

SHARPSharp Corporation

夏普

STACKED CHIP 32M FLASH AND 8M SRAM

Description The LRS1382 is a combination memory organized as 2,097,152 x16 bit flash memory and 524.288 x16 bit static RAM in one package. Features - Power supply • • • • 2.7V to 3.3V - Operating temperature • • • • -25°C to +85°C - Not designed or rated as radiation hardened - 72pin CSP (LC

文件：3.59134 Mbytes 页数：114 Pages

SHARPSharp Corporation

夏普

STACKED CHIP 32M FLASH AND 8M SRAM

Description The LRS1383 is a combination memory organized as 2,097,152 x16 bit flash memory and 524.288 x16 bit static RAM in one package. Features - Power supply • • • • 2.7V to 3.3V - Operating temperature • • • • -25°C to +85°C - Not designed or rated as radiation hardened - 72pin CSP (LC

文件：3.59319 Mbytes 页数：114 Pages

SHARPSharp Corporation

夏普