LMZ31506RUQT电源-板安装的直流转换器规格书PDF中文资料

LMZ31506RUQT属于电源-板安装的直流转换器。由德州仪器制造生产的LMZ31506RUQT直流转换器一种旨在将直流电压输入电平改变为一个或多个不同的直流电压输出电平的装置。

1 Features

1• Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

• 9-mm × 15-mm × 2.8-mm package

- Pin Compatible with LMZ31503

• Efficiencies Up To 96%

• Wide-Output Voltage Adjust

0.6 V to 5.5 V, with 1% Reference Accuracy

• Supports Parallel Operation for Higher Current

• Optional Split Power Rail Allows

Input Voltage down to 1.6 V

• Adjustable Switching Frequency

(250 kHz to 780 kHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Output Overcurrent Protection (Hiccup Mode)

• Over-Temperature Protection

• Pre-bias Output Start-up

• Operating Temperature Range: –40°C to 85°C

• Enhanced Thermal Performance: 13°C/W

• Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ31506

With the WEBENCH® Power Designer

2 Applications

• Broadband & Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI, PCI Express and PXI Express

• DSP and FPGA Point of Load Applications

3 Description

The LMZ31506 power module is an easy-to-use

integrated power solution that combines a 6-A DC-to-

DC converter with power MOSFETs, a shielded

inductor, and passives into a low profile, QFN

package. This total power solution allows as few as

three external components and eliminates the loop

compensation and magnetics part selection process.

The 9×15×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 13°C/W junction to ambient. The

device delivers the full 6-A rated output current at

85°C ambient temperature without airflow.

The LMZ31506 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.