LMZ31503RUQR电源-板安装的直流转换器规格书PDF中文资料

LMZ31503RUQR属于电源-板安装的直流转换器。由德州仪器制造生产的LMZ31503RUQR直流转换器一种旨在将直流电压输入电平改变为一个或多个不同的直流电压输出电平的装置。

1 Features

1• Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

• 9 mm × 15mm × 2.8mm package

- Pin Compatible with LMZ31506

• Efficiencies Up To 95%

• Wide-Output Voltage Adjust

0.8 V to 5.5 V, with 1% Reference Accuracy

• Optional Split Power Rail Allows

Input Voltage Down to 1.6 V

• Adjustable Switching Frequency

(330 kHz to 780 kHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Overcurrent Protection (Hiccup-Mode)

• Over Temperature Protection

• Pre-bias Output Start-up

• Operating Temperature Range: –40°C to +85°C

• Enhanced Thermal Performance: 13°C/W

• Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ31503

With the WEBENCH® Power Designer

2 Applications

• Broadband & Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI / PCI Express / PXI Express

• DSP and FPGA Point of Load Applications

• High Density Distributed Power Systems

3 Description

The LMZ31503 power module is an easy-to-use

integrated power solution that combines a 3-A DC/DC

converter with power MOSFETs, a shielded inductor,

and passives into a low profile, QFN package. This

total power solution allows as few as 3 external

components and eliminates the loop compensation

and magnetics design process.

The 9×15×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with up to 95% efficiency and

excellent power dissipation with a thermal impedance

of 13°C/W junction to ambient. The device delivers

the full 3-A rated output current at 85°C ambient

temperature without airflow.

The LMZ31503 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.