LE57D122数据手册集成电路（IC）的电信规格书PDF

描述 Description

The innovative Le57D122 dual-channel SLIC device is designed for high-density POTS applications requiring a small-footprint, low-power SLIC device. By combining a fully featured line interface of two channels into one SLIC device, the Le57D122 device enables the design of a low-cost, high performance, and fully programmable line interface for multiple country applications worldwide, including Ground Start and metering capability. The on-chip Thermal Management (TMG) feature allows for significantly reduced power dissipation on the device. Optional dual battery operation to reduce total power consumption is also available. The device is offered in a thermally efficient, space-saving 44-pin eTQFP package. The 12 x 12 mm footprint allows designers to make a dramatic increase in the density of lines on a board. The Le57D122 device is also designed to significantly reduce the number of external components required for line card design. Microchip offers a range of compatible SLAC devices that perform the codec function in a line card. In particular, the Microchip Quad and Octal SLAC devices combined with the Le57D122 device provides a programmable line circuit that can be configured for varying requirements.

特性 Features

Dual-Channel SLIC device with small footprint

简介

LE57D122属于集成电路（IC）的电信。由制造生产的LE57D122电信电信接口集成电路 (IC) 为通信网络接口提供特定功能和控制，例如以太网切换、线路驱动器、ISDN、放大器、通道扩展器、数字锁相环、DTMF、音频发生器和解码器、回声消除、检测器和发生器、DDA、电话线路监控器和主叫号码标识。