丝印：L9602；Package：SOP-8；30V Complementary Enhancement Mode MOSFET

Features  Advanced Trench Process Technology  Low Gate Charge  Low reverse transfer capacitance  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard Mechanical Data  Case: SOP-8 Package  Terminals: Solderable per MIL-STD-750, Method 2026  App

文件：566.96 Kbytes 页数：9 Pages

PANJIT

強茂