零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
---|---|---|---|---|
SMDSchottkyBarrierDiode Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -AEC-Q101Qualified. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
InternallyMatchedLNAModule | ASB Advanced Semiconductor Business Inc. | ASB | ||
InternallyMatchedLNAModule | ASB Advanced Semiconductor Business Inc. | ASB | ||
FullHDDigitalImageSensor | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
1/2.7-Inch2.1Mp/FullHDDigitalImageSensor | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
1/2.7?릋nch2.1Mp/FullHDDigitalImageSensor | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
SMDSchottkyBarrierDiode Features IO=200mA VR=30V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowdrop-downvoltage. -Majoritycarrierconduction -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,sold | ANACHIP 易亨易亨电子股份有限公司 | ANACHIP | ||
N-ChannelMOSFETusesadvancedtrenchtechnology | DOINGTERSHENZHEN DOINGTER SEMICONDUCTOR CO., LTD. 杜因特深圳市杜因特半导体有限公司 | DOINGTER | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solde | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
只做原装 |
21+ |
QFP-32L |
36520 |
一级代理/放心采购 |
询价 | ||
01+ |
DIP-20P |
25 |
现货 |
询价 | |||
FENICS |
01+ |
DIP-20P |
87 |
原装现货海量库存欢迎咨询 |
询价 | ||
FENICS |
21+ |
DIP |
7540 |
只做原装正品假一赔十!正规渠道订货! |
询价 | ||
FENICS |
DIP |
13000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
询价 | |||
https://www.aliexpress.com/ite |
中性 |
200 |
询价 | ||||
SEMTECH |
23+ |
SOP16 |
1800 |
现货库存,全新原装,特价销售 |
询价 | ||
SEMTECH |
22+ |
SOP-16 |
2560 |
绝对原装!现货热卖! |
询价 | ||
SEMTECH |
6000 |
面议 |
19 |
SOP16 |
询价 | ||
23+ |
65480 |
询价 |