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ACDBQC0230R-HF

SMDSchottkyBarrierDiode

Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -AEC-Q101Qualified.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ACDBUC0230-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ALN0230

InternallyMatchedLNAModule

ASB

Advanced Semiconductor Business Inc.

ALN0230

InternallyMatchedLNAModule

ASB

Advanced Semiconductor Business Inc.

AR0230

FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

AR0230CS

1/2.7-Inch2.1Mp/FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

AR0230CS

1/2.7?릋nch2.1Mp/FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

ASB0230

SMDSchottkyBarrierDiode

Features IO=200mA VR=30V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowdrop-downvoltage. -Majoritycarrierconduction -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,sold

ANACHIP

易亨易亨电子股份有限公司

B0230D

N-ChannelMOSFETusesadvancedtrenchtechnology

DOINGTERSHENZHEN DOINGTER SEMICONDUCTOR CO., LTD.

杜因特深圳市杜因特半导体有限公司

CDBER0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230R-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBERT0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230-HF

SMDSchottkyBarrierDiode

Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230R-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Halogenfree. Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solde

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供应商型号品牌批号封装库存备注价格
只做原装
21+
QFP-32L
36520
一级代理/放心采购
询价
01+
DIP-20P
25
现货
询价
FENICS
01+
DIP-20P
87
原装现货海量库存欢迎咨询
询价
FENICS
21+
DIP
7540
只做原装正品假一赔十!正规渠道订货!
询价
FENICS
DIP
13000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
https://www.aliexpress.com/ite
中性
200
询价
SEMTECH
23+
SOP16
1800
现货库存,全新原装,特价销售
询价
SEMTECH
22+
SOP-16
2560
绝对原装!现货热卖!
询价
SEMTECH
6000
面议
19
SOP16
询价
23+
65480
询价
更多KY0230供应商 更新时间2024-5-2 9:30:00