首页 >KT11B2SAMTR-LF>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SealedTactileSwitches | CK-COMPONENTS C&K Components | CK-COMPONENTS | ||
Plug-inSignalConditionersK-UNIT | MSYSTEMM-System Co.,Ltd. 爱模爱模系统有限公司 | MSYSTEM | ||
Plug-inSignalConditionersK-UNIT | MSYSTEMM-System Co.,Ltd. 爱模爱模系统有限公司 | MSYSTEM | ||
Plug-inSignalConditionersK-UNIT | MSYSTEMM-System Co.,Ltd. 爱模爱模系统有限公司 | MSYSTEM | ||
PowerTransducerSeriesL-UNIT | MSYSTEMM-System Co.,Ltd. 爱模爱模系统有限公司 | MSYSTEM | ||
PowerTransducerSeriesL-UNIT | MSYSTEMM-System Co.,Ltd. 爱模爱模系统有限公司 | MSYSTEM | ||
SingleZenerdiodesinaSOD323Fpackage | PhilipsPhilips Semiconductors 飞利浦荷兰皇家飞利浦 | Philips | ||
SingleZenerdiodesinaSOD882package 1.1.Generaldescription General-purposeZenerdiodesinaSOD882leadlessultrasmallSurface-MountedDevice(SMD) plasticpackage. 1.2.Features •Non-repetitivepeakrerversepowerdissipation:PZSM≤40W •Totalpowerdissipation:Ptot≤250mW •Toleranceseries:B:approximately±5 | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
SiliconPlanarZenerDiodeforStabilizedPowerSupply Features •Lowleakage,lowzenerimpedanceandmaximumpowerdissipationof500mW. •Widespectrumfrom1.9Vthrough38Vofzenervoltageprovideflexibleapplication. •LLDPackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconPlanarZenerDiodeforSurgeAbsorptionandStabilizer Features •EmbossTapingReelPack. •UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS |
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