2.5 AMPS FAST RECOVERY RECTIFIER CHIP 50 - 150 VOLTS

FEATURES: • Chip Outline Dimensions: 41 x 41 mils • Chip Thickness: 8 to 12 mils • Anode Metallization: Aluminum • Metallization Thickness: 50,000Ã Nominal • Bonding Area: 23 x 23 mils Min. • Back Metallization: Gold • Junction Passivated with Thermal Silicon Dioxide - Planar Design • Back

文件：46.75 Kbytes 页数：3 Pages

Microsemi

美高森美

Package：模具；包装：卷带（TR） 类别：分立半导体产品 二极管 - 整流器 - 单 描述：RECTIFIER UFR,FRR

Microchip

微芯科技

2.5 AMPS FAST RECOVERY RECTIFIER CHIP 50 - 150 VOLTS

FEATURES: • Chip Outline Dimensions: 41 x 41 mils • Chip Thickness: 8 to 12 mils • Anode Metallization: Aluminum • Metallization Thickness: 50,000Ã Nominal • Bonding Area: 23 x 23 mils Min. • Back Metallization: Gold • Junction Passivated with Thermal Silicon Dioxide - Planar Design • Back

文件：46.75 Kbytes 页数：3 Pages

Microsemi

美高森美

MILITARY APPROVED HIGH EFFICIENCY 2.5 AMP AND 6.0 AMP

DESCRIPTION This “ultrafast recovery” rectifier diode series is military qualified to MIL-PRF-19500/477 and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 2.5 Amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are

文件：318.28 Kbytes 页数：2 Pages

Microsemi

美高森美

ULTRA FAST MILITARY RECTIFIERS

文件：53.36 Kbytes 页数：2 Pages

Microsemi

美高森美