首页 >J552>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
ESCPACKAGE FORHIGHSPEEDSWITCHING. FEATURES •Lowreversecurrent,Lowcapacitance. •SmallPackage:ESC. | KECKEC CORPORATION KEC株式会社 | KEC | ||
HIGHSPEEDSWITCHING FORHIGHSPEEDSWITCHING. FEATURES •Lowreversecurrent,Lowcapacitance. •SmallPackage:TFSC. •SuffixU:QualifiedtoAEC-Q101. ex)KDR552F-RTK/HU | KECKEC CORPORATION KEC株式会社 | KEC | ||
MOSFIELDEFFECTTRANSISTORSMOSFELDEFFECT-TRANSISTOREN MOSFIELDEFFECTTRANSISTORS DUALMOSFIELDEFFECTTRANSISTORSWITHCHANNELP JUNCTIONFIELDEFFECTTRANSISTORSWITHCHANNELNFORVERYHIGHSPEEDCIRCUITSANDCHOPPERS | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
EPITAXIALPLANARPNPTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式会社 | KEC | ||
SEMICONDUCTOR SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式会社 | KEC | ||
PowerModules •LowProfile •7DifferentCircuitstoChoosefrom •DesignedforPrintedCircuitBoardConnections | crydom Crydom Inc., | crydom | ||
LowProfileDesignedforPCBConnections | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
PowerModules •LowProfile •7DifferentCircuitstoChoosefrom •DesignedforPrintedCircuitBoardConnections | crydom Crydom Inc., | crydom | ||
HighPowerClassBAmplifier | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
Single-StagePowerFactorCorrectedOff-LineSwitchingRegulatorIC | SankenSanken electric 三垦三垦电气株式会社 | Sanken |
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