IS66WVQ16M4FALL中文资料矽成半导体数据手册PDF规格书

FEATURES

• Industry Standard Serial Interface

- Quad DDR (x4 xSPI) Interface:

Command (1 byte) =SDR

Address (2-byte) & Data = DDR

- Low Signal Counts :7 Signal pins (CS#,

SCLK, DQSM, SIO0~SIO3)

• High Performance

- Double Data Rate (DDR) Operation:

200MHz (200MB/s)

- Source Synchronous Output signal during

Read Operation (DQSM)

- Data Mask during Write Operation

(DQSM)

- Configurable Latency for Read/Write

Operation

- Supports Variable Latency mode and

Fixed Latency mode

- Configurable Drive Strength

- Supports Wrapped Burst mode and

Continuous Burst mode

• Burst Operation

- Wrapped Burst and Hybrid Wrapped

Burst

- Configurable Wrapped Burst Length:

16B, 32B, 64B, and 128B

- Byte Order Burst Sequence

- Continuous Operation:

Continues Read operation until the end

of array address (No Wrapped)

Continues Write operation even after the

end of array address (Wrapped to the

first address)

• Reset Operation

- Hardware Reset: RESET# ball.

- In-Band Reset

• Supply Voltage

- Single 1.7V to 1.95V Voltage Supply

- Single 2.7V to 3.6V Voltage Supply

• Hardware Features

- SCLK Input: Serial clock input

- SIO0 – SIO3:

Serial Data Input or Serial Data Output

- DQSM:

- Output during command, address

transactions as Refresh Collision

Indicator

- Output during read data transactions

as Read Data Strobe

- Input during write data transactions as

Write Data Mask (SDR, Byte Mask)

- RESET#: Hardware Reset pin

• Low Power Features

- Auto Temperature Compensated Self-

Refresh (ATCSR) by built-in temperature

sensor.

- Partial Refresh during Standby mode

- Supports Deep Power Down mode

- Ultra Low Power Hybrid Sleep mode with

data retained.

• Temperature Grades

- Industrial: -40°C to +85°C

- Auto (A2) Grade: -40°C to +105°C

• Industry Standard PACKAGE

- B = 24-ball TFBGA 6x8mm 5x5 Array

- KGD (Call Factory)

- Green Package (RoHS Compliant,

Halogen-Free) and TSCA Compliant