IS66WVO8M8DBLL-166BLA3中文资料矽成半导体数据手册PDF规格书

FEATURES

• Industry Standard Serial Interface

- Octal Peripheral Interface (OPI) Protocol

- Low Signal Counts :11 Signal pins (CS#,

SCLK, DQSM, SIO0~SIO7)

• High Performance

- Up to 400MB/s

- Double Transfer Rate (DTR) Operation

- 200MHz (400MB/s) at 105°C

- 166MHz (332MB/s) at 125°C

- Source Synchronous Output signal during

Read Operation (DQSM)

- Data Mask during Write Operation

(DQSM)

- Configurable Latency for Read/Write

Operation)

- Supports Variable Latency mode and

Fixed Latency mode

- Configurable Drive Strength

- Supports Wrapped Burst mode and

Continuous Burst mode

- Supports Deep Power Down mode

- Hidden Refresh

• Burst Operation

- Configurable Wrapped Burst Length :

16, 32, 64, and 128

- Word Order Burst Sequence

- Continuous Burst Operation:

- Continues Read operation until the end

of array address

- Continues Write operation even after the

end of array address

• Low Power Consumption

- Single 1.7V to 1.95V Voltage Supply

- Single 2.7V to 3.6V Voltage Supply

- 375 μA Standby Current (typ.) at 105°C.

• Hardware Features

- SCLK Input: Serial clock input

- SIO0 - SIO7:

Serial Data Input or Serial Data Output

- DQSM:

- Output during command, address

transactions as Refresh Collision

Indicator

- Output during read data transactions

as Read Data Strobe

- Input during write data transactions as

Write Data Mask

- RESET#: Hardware Reset pin

• Temperature Grades

- Industrial: -40°C to +85°C

- Auto (A2) Grade: -40°C to +105°C

- Auto (A3) Grade: -40°C to +125°C

• Industry Standard PACKAGE

- B = 24-ball TFBGA 6x8mm 5x5 Array

- KGD (Call Factory)