首页>IS21SLASH22TF64G>规格书详情

IS21SLASH22TF64G中文资料矽成半导体数据手册PDF规格书

PDF无图
厂商型号

IS21SLASH22TF64G

功能描述

16GB/32GB/64GB/128GB eMMC With eMMC 5.1 Interface & TLC NAND

文件大小

834.7 Kbytes

页面数量

36

生产厂商

ISSI

中文名称

矽成半导体

网址

网址

数据手册

下载地址一下载地址二

更新时间

2025-12-11 22:50:00

人工找货

IS21SLASH22TF64G价格和库存,欢迎联系客服免费人工找货

IS21SLASH22TF64G规格书详情

GENERAL DESCRIPTION

ISSI eMMC products follow the JEDEC eMMC 5.1 standard. It is ideal for embedded storage solutions for Industrial application and automotive application, which require high performance across a wide range of operating temperatures. eMMC encloses the TLC Mode NAND and eMMC controller inside as one JEDEC standard package, providing a standard interface to the host. The eMMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing.

FEATURES

• Packaged NAND flash memory with eMMC 5.1 interface

- IS21/22TF16G: 16Gigabyte

- IS21/22TF32G: 32Gigabyte

- IS21/22TF64G: 64Gigabyte

- IS21/22TF128G: 128Gigabyte

• Compliant with eMMC Specification Ver.4.3, 4.4, 4.41,4.5, 4.51, 5.0, 5.1

• Device can be converted to eMMC 4.3, 4.41, 4.51, 5.0 via initializing

• Bus mode

- High-speed eMMC protocol

- Clock frequency: 0-200MHz.

- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.

• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits

- Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)

- Single data rate : up to 200Mbyte/s @ 200MHz (HS200)

- Dual data rate : up to 400Mbyte/s @ 200MHz (HS400)

• Operating voltage range :

- VCCQ = 1.8 V/3.3 V (Automotive A2 Grade only supports 1.8V VCCQ)

- VCC = 2.7 – 3.6V

• Error free memory access

- Internal error correction code (ECC) to protect data communication

- Internal enhanced data management algorithm

- Solid protection from sudden power failure, safe-update operations for data content

• Security

- Support secure erase and trim commands

- Enhanced write protection with permanent and partial protection options

• Key Features :

- HS400, Field Firmware Update (FFU), Power Off Notification, Pre EOL information, Enhanced Device Life

time, Optimal Size

• eMMC 5.1 Features:

- Command Queuing, Enhanced Strobe, Cache Flushing Report, BKOPS Control, Cache Barrier, RPMB

Throughput Improve, Secure Write Protection.

• Temperature range

- Industrial Grade (I): -40 ℃ ~ 85 ℃

- Automotive Grade (A1): -40 ℃ ~ 85 ℃

- Automotive Grade (A2): -40 ℃ ~ 105 ℃ (The Surface Temperature of Tc cannot be over 115 ℃)

• Package

- 153 FBGA (11.5mm x 13mm x 1.0mm)

- 100 FBGA (14.0mm x 18.0mm x 1.4mm)

供应商 型号 品牌 批号 封装 库存 备注 价格
ISSI
23+
DIP
6500
全新原装假一赔十
询价
ISOCOM
25+
DIPSOP
65248
百分百原装现货 实单必成
询价
ISSI
23+
BGA
4500
ISSI存储芯片在售
询价
ACECOM
NA
8560
一级代理 原装正品假一罚十价格优势长期供货
询价
ISOCOM
23+
DIP SOP
4674
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
ISSI
25+
QFN
18000
原厂直接发货进口原装
询价
ISSI/芯成
2450+
BGA153
8850
只做原装正品假一赔十为客户做到零风险!!
询价
ISSI
25+23+
DIP16
18771
绝对原装正品全新进口深圳现货
询价
ISSI
22+
DIP-16
8000
原装正品支持实单
询价
24+
32000
全新原厂原装正品现货,低价出售,实单可谈
询价