THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

文件：225.9 Kbytes 页数：8 Pages

IRF

ADD-A-pak GEN V Power Modules THYRISTOR/ THYRISTOR

文件：117.92 Kbytes 页数：8 Pages

IRF

TO-263

IR

国际整流器

上传：深圳市得捷芯城科技有限公司

TO-220

INFINEON/英飞凌

上传：深圳市华芯伟电子科技有限公司

TO-223

INFINEON/英飞凌

上传：深圳市周芯芯半导体有限公司