IRFIBE20GPBF.中文资料IRF数据手册PDF规格书

DESCRIPTION

Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.

• Isolated Package

• High Voltage Isolation = 2.5KVRMS

• Sink to Lead Creepage Dist.=4.8mm

• Dynamic dV/dt Rating

• Low Thermal Resistance