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CMR1-04M

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

SURFACEMOUNTGENERALPURPOSERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

产品属性

  • 产品编号:

    IPM1-04-D

  • 制造商:

    Samtec Inc.

  • 类别:

    连接器,互连器件 > 矩形连接器外壳

  • 系列:

    Mini Mate® IPM1

  • 包装:

    散装

  • 触头类型:

    公形引脚

  • 针位数:

    8

  • 间距:

    0.100"(2.54mm)

  • 排距:

    0.100"(2.54mm)

  • 安装类型:

    自由悬挂

  • 触头端接:

    压接

  • 紧固类型:

    锁销滑道

  • 颜色:

    白色

  • 描述:

    CONN HSG 8POS 2.54MM

供应商型号品牌批号封装库存备注价格
SAMTEC
20+
连接器
2963
就找我吧!--邀您体验愉快问购元件!
询价
Samtec
2022+
原厂原包装
6800
全新原装 支持表配单 中国著名电子元器件独立分销
询价
24+
N/A
56000
一级代理-主营优势-实惠价格-不悔选择
询价
SAMTEC
2406+
NA
17385
优势代理渠道,原装现货,可全系列订货
询价
23+
DIP
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
DELTA
2022+
53
全新原装 货期两周
询价
DELTA
23+
SMD
1200
原装现货假一赔十
询价
Delta
22+
NA
12080
加我QQ或微信咨询更多详细信息,
询价
Delta
2016+
SMD
6528
只做原装正品现货!或订货!假一赔十!
询价
Delta
SMD
6688
15
现货库存
询价
更多IPM1-04-D供应商 更新时间2025-5-21 14:01:00