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IPM1-04-D

包装:散装 类别:连接器,互连器件 矩形连接器外壳 描述:CONN HSG 8POS 2.54MM

SamtecSamtec Inc.

申泰

BL1-04

1ABRIDGERECTIFIERS

FRONTIER

Frontier Electronics

CBRLD1-04

SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美国中央半导体

CBRLD1-04

SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER

CentralCentral Semiconductor Corp

美国中央半导体

CMMR1-04

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美国中央半导体

CMMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美国中央半导体

CMMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1.0AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTOR1.0AmpSurfaceMountSiliconRectifierisahighquality,wellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplications.Toorderdeviceson12mmTapeandReel(3000

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP

CentralCentral Semiconductor Corp

美国中央半导体

CMR1-04M

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04

SURFACEMOUNTGENERALPURPOSERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CXR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000Å/2,000Å BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美国中央半导体

产品属性

  • 产品编号:

    IPM1-04-D

  • 制造商:

    Samtec Inc.

  • 类别:

    连接器,互连器件 > 矩形连接器外壳

  • 系列:

    Mini Mate® IPM1

  • 包装:

    散装

  • 触头类型:

    公形引脚

  • 针位数:

    8

  • 间距:

    0.100"(2.54mm)

  • 排距:

    0.100"(2.54mm)

  • 安装类型:

    自由悬挂

  • 触头端接:

    压接

  • 紧固类型:

    锁销滑道

  • 颜色:

    白色

  • 描述:

    CONN HSG 8POS 2.54MM

供应商型号品牌批号封装库存备注价格
SAMTEC
20+
连接器
2963
就找我吧!--邀您体验愉快问购元件!
询价
Samtec
2308+
554998
一级代理,原装正品,公司现货!
询价
Samtec
2022+
原厂原包装
6800
全新原装 支持表配单 中国著名电子元器件独立分销
询价
SAMTEC
23+
强势砷泰
6800
砷泰专家/可订期货
询价
21+ROHS
DIP
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
DELTA
2022+
53
全新原装 货期两周
询价
DELTA
23+
SMD
1200
原装现货假一赔十
询价
DELTA
12+
SMD
1200
刚到现货加微13425146986
询价
DELTA/台达
20+
SMD
9850
只做原装正品假一赔十为客户做到零风险!!
询价
DELTA
22+
SMD
9852
只做原装正品现货,或订货假一赔十!
询价
更多IPM1-04-D供应商 更新时间2024-5-1 14:00:00