AP6255代理，价格优势 咨询电话13828760986 赵
深圳世联芯科技 专业代理正基WIFI模块，AP6212 Ap6255 Ap6234 Ap6335 Ap6356s Ap6251
AP6255是最新一代带SDIO3.0版的借口WIFI模块
AP6255样品申请QQ 2677332671
AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the Wi-Fi, Bluetooth functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11a/b/g/n/ac Access Points in the wireless LAN. The wireless module complies with IEEE 802.11 a/b/g/n/ac standard and it can achieve up to a speed of 433.3Mbps with single stream in 802.11ac draft to connect to the wireless LAN. The integrated module provides SDIO interface for Wi-Fi, UART / PCM interface for Bluetooth. This compact module is a total solution for a combination of Wi-Fi + BT technologies. The module is specifically developed for Smart phones and Portable devices.
AP6255 Datasheet AMPAK Technology Inc.
www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 5 2. Features IEEE 802.11a/b/g/n/ac dual-band radio with virtual-simultaneous dual-band operation Single-stream spatial multiplexing up to 433.3 Mbps data rate. Supports 20, 40, 80 MHz channels with optional SGI(256 QAM modulation) Bluetooth V4.0+EDR with integrated Class 1 PA and Low Energy (BLE) support Concurrent Bluetooth, and WLAN operation Simultaneous BT/WLAN receive with single antenna Supports standard SDIO v3.0 and backward compatible with SDIO v2.0 host interfaces. - SDIO v3.0(4-bit) — up to 208 MHz clock rate in SDR104 mode BT host digital interface: - UART (up to 4 Mbps) IEEE Co-existence technologies are integrated die solution ECI — enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives A simplified block diagram of the module is depicted in the figure below
AP6255广泛应用于广告机 平板电脑 网络机顶盒 和 无人机 投影仪 VR
