IGCM20F60GA数据手册分立半导体产品的功率驱动器模块规格书PDF

描述 Description

CIPOS™ Mini transfer-molded intelligent power modules achieve cost efficiency and were designed specifically for home appliance and low power industrial application with a current rating from 4A to 30A and a power rating up to 3kW.

特性 Features

·Fully isolated Dual In-Line molded module
·Based on Reverse Conducting IGBT technology from Infineon
·For IKCM Series, TRENCHSTOP™ IGBTs are used with seperated anti-paralled diodes
·Rugged 3-phase SOI gate driver technology with stability against transient and negative voltage
·Integrated bootstrap circuit
·Single phase diode bridge rectifier (Optional)
·Temperature sense (Optional)
·Under-voltage lockout
·Over-current protection
·Cross-conduction prevention
·UL1577 certificated

应用 Application

简介

IGCM20F60GA属于分立半导体产品的功率驱动器模块。由制造生产的IGCM20F60GA功率驱动器模块功率驱动器模块为电源组件（通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET）提供物理防护。功率半导体或裸片将焊接或烧结在基材上，后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度，并且在许多情况下更可靠且更易于冷却。