HSMF-C11B中文资料0404 Tri-color Top-View ChipLED数据手册Broadcom规格书

描述 Description

HSMF-C11B is a high brightness tricolor ChipLED in a top view package. It uses Aluminum Indium Gallium Phosphide (AllnGaP) and Indium Gallium Nitride chip technology which enables this product deliver industry-leading light output performance.

This LED comes with very small package size of 1.08mm x 1.08mm and it has the thinnest package height in Broadcom’s tricolor ChipLED family. This ultra-thin profile feature makes this LED ideal for applications require low package height and the small package footprint allows the LEDs capable of supporting assembly in a close pitch configuration.

This chipLED is compatible with reflow soldering processes. For easy pick-and-place, the parts are packed in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity control.

特性 Features

•LEDwithAlInGaPRed,InGaNGreenandBlue
•Compatiblewithreflowsoldering
•Availablein8mmtapeand7\"diameterreel

应用 Application

Backlighting
Status Indicator
Front Panel Indicator
Office Automation, Home Appliances, Industrial Equipment

简介

HSMF-C11B属于光电器件的LED指示-分立。由制造生产的HSMF-C11BLED 指示 - 分立发光二极管是在导电时发光的半导体器件。该系列中的 LED 采用单一或阵列配置，用于印刷电路板上的状态指示。这些 LED 通过封装/外壳、波长、视角、正向电压、额定电流、毫烛光等级、颜色和安装类型进行区分。配置包括共阳极或阴极以及双向。