HSMF-C114中文资料Surface Mount Tricolor ChipLEDs数据手册Broadcom规格书

描述 Description

The HSMF-C114 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging and be the thinnest package in the industry for tricolor package. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme.
The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication and front panel illumination applications.
In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 4000 units per reel. The package is compatible with reflow soldering and binned by both color and intensity.

特性 Features

• Common anode
• Small 1.6 x 1.5 x 0.35 mm package
• Diffused optics
• Red/Green/Blue color combination
• Available in 8 mm tape on 7” diameter reels
• High brightness using AlInGaP and InGaN die technology
• Compatible with reflow soldering

应用 Application

Backlighting
Status Indicator
Front Panel Indicator
Office Automation, Home Appliances, Industrial Equipment

简介

HSMF-C114属于光电器件的LED指示-分立。由制造生产的HSMF-C114LED 指示 - 分立发光二极管是在导电时发光的半导体器件。该系列中的 LED 采用单一或阵列配置，用于印刷电路板上的状态指示。这些 LED 通过封装/外壳、波长、视角、正向电压、额定电流、毫烛光等级、颜色和安装类型进行区分。配置包括共阳极或阴极以及双向。