HS8298D数据手册OnMicro中文资料规格书

描述 Description

The HS8298D is a complete CMOS high-power, high-efficiency transmit module for low cost dual-band TX (EGSM900/DCS1800)/dual-band RX GSM/GPRS mobile handsets. Power amplifier, Power controller circuit and switch circuit have been integrated in a single CMOS chip. Internal TX/RX 50Ω matching, DC blocking on TX/Ant and harmonic filtering circuits are integrated, and this eliminates the extra need of external components, simplifies layout and reduces board space as well. The advanced front-end module architecture has been designed specifically to use standard CMOS technology to implement high output power at high efficiency over all the operating conditions. No external compensation for temperature, frequency or battery is another advantage to meet RF performance over various conditions. The module is packaged in a small LGA format (5.25mm x5.3mm x0.82mm).
 
 

 

Functional Block Diagram
 

 

特性 Features

High Output Power
• 33.5dBm(typ.) at EGSM900
• 31.0dBm(typ.) at DCS1800
High Power Added Efficiency
• EGSM900 45% PAE
• DCS1800 35% PAE
Integrated Control and Protection
 

应用 Application

• VBATT Operating range 3.3V to 4.5V
• Complete power control solution
• Advanced CMOS process 
• LGA 5.25mm x5.30mm x 0.82mm 
• Dual-band cellular handsets
• Multimode Mobile Handset Applications
• GPRS Class 12 Compliant
• Portable Battery-Powered Equipment
 
Product Description
The HS8298D is a complete CMOS high-power, high-efficiency transmit module for low cost dual-band TX (EGSM900/DCS1800)/dual-band RX GSM/GPRS mobile handsets. Power amplifier, Power controller circuit and switch circuit have been integrated in a single CMOS chip. Internal TX/RX 50Ω matching, DC blocking on TX/Ant and harmonic filtering circuits are integrated, and this eliminates the extra need of external components, simplifies layout and reduces board space as well. The advanced front-end module architecture has been designed specifically to use standard CMOS technology to implement high output power at high efficiency over all the operating conditions. No external compensation for temperature, frequency or battery is another advantage to meet RF performance over various conditions. The module is packaged in a small LGA format (5.25mm x5.3mm x0.82mm).